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*CAD / CAM / 2D / 3D system for the shoemaking industry

CSM3D International Limited Homepage
- Shoemaster QS 3.04

- Shoemaster QS 6.02

- Shoemaster QS 6.03

- Shoemaster QS 7.01

Comelz Homepage
- Comelz CALCAD Ver 3.94

USM Homepage

- USM2-v1.11

- USM3-v1.04

EasyLast Homepage

- Easylast2.5

PROCAM Homepage

- Dimensions 4.3

- Dimensions 5.1

Lectra Footwear Homepage

- Romanscad 2D V7.0

- Romanscad 3D V7.0

- Romanscad CUT V7.0

- Romanscad SL V7.0

- Romanscad SOLE V7.0 

CRISPIN Dynamics Homepage

- Crispin Shoedesign 1.0.87.0
- Crispin Engineer 2.2.1

- Crispin PatternCut 1.1.148

- Cadwin 8.0-SR-34
- Comelz Caligola Ver 3.99
- Comelz Caligola Ver 4.1.17
- Crispin 2D Utilities Ver 2.00.11
- Crispin 2DViewer Ver 2.2.1
- Crispin 2DViewer Ver 2.4.13
- Crispin 2DViewer Ver 2.8.1 
- Crispin 3D Ver 2.2.2
- Crispin 3DViewer Ver 2.2.3
- Crispin 3DViewer Ver 2.6.14
- Crispin Engineer Ver 2.2.1
- Crispin Engineer Ver 2.4.11 
- Crispin Engineer Ver 2.6.2
- Crispin Engineer Ver 2.8.1 
- Crispin Knifecut Ver 2.18.07 
- Crispin Knifecut Ver 2.18.11
- Crispin LastMaker Ver 2.4.0a 
- Crispin LastMaker Ver 2.6.1
- Crispin LastMaker Ver 2.9.0
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- Crispin Orthotec Ver 2.4.11 
- Crispin Orthotec Ver 2.6.2
- Crispin Orthotec Ver 2.8.1 
- Crispin PatternCut Ver 1.1.148
- Crispin PatternCut Ver 1.1.151 
- Crispin ShoeCost Ver 2.0.8
- Crispin ShoeCost Ver 2.2.1
- Crispin ShoeCost Ver 2.4.0 
- Crispin Shoedesign Ver 1.0.87
- Crispin ShoeDesign Ver 2.6.16
- Crispin ShoeDesign 2010 Ver 3.0.0.1
- Crispin Stitchtec Ver 2.4.11
- Crispin Stitchtec Ver 2.6.2
- Crispin Stitchtec Ver 2.8.1
- Delcam PowerShape Ver 7.0.80
- Delcam PS-Exchange Ver 4.9.0504
- Delcam PS-Exchange Ver 5.0.06

- DiDACTiCAD 1.0-a2
- EasyCut2D Ver 1.1.0 
- EasyLast3D Ver 2.5
- ElitronCAD Ver 2.2.5

- LEACad Ver 1.0.23

- Lectra Diamino Footwear V5R2 
- Lectra Romanscad Ver 6.0 (2D-3D-CUT-SL-SOLE) 
- Lectra Romanscad Ver 7.0 (2D-3D-CUT-SL-SOLE) 
- Lectra Romanscad Ver 8.0 (2D-3D-CUT-SL-SOLE) 
- Lectra Romanscad 3D Ver 8.4-n2
- Lectra Romanscad Ver 8.9 (2D-3D-CUT-SL-SOLE) 
- Lectra Romanscad Ver 9.3 (2D-3D-CUT-SL-SOLE-XXL)

- MindCAD 2011

- Modo Ver 302 
- ProCam Dimensions Ver 4.3.0
- ProCam Dimensions Ver 5.1.0.12
- ProCam GDM Editor V3.0.17 
- QS Forma v2.0
- QS Forma v4.5 
- RisingStar Ver 5.1
- Shoe CAD Ver 8.412
- Shoe CAM Ver 4.2

- Shoemaster PDM Ver 1.1
- Shoemaster QS v12.02

- Shoemaster QS Ver 3.04 
- Shoemaster QS Ver 6.02
- Shoemaster QS Ver 6.03
- Shoemaster QS Ver 7.01 
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- Shoemaster QS Ver 10.01
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- Shoemaster QS Ver 10.03
- Shoemaster QS Ver 10.04 
- Sipeco_RGP Ver 1.5 
- Teseo NAXOS Ver 1.6 
- Teseo NAXOS Ver 1.7 
- USM2 Ver 1.14 

- USM3 Ver 1.04

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As tough market competition demands faster cycle times, lower software costs and lower user qualification thresholds, Engineering Technology Associates, Inc. (ETA) has developed a new tool, the INC Solver, to address these needs. The solver is included in DYNAFORM 5.7.3, released today.

To expaBody Side Simulationnd the usability of DYNAFORM’s Die Face Engineering (DFE) module, INC is a finite element analysis (FEA) solver designed for sheet metal forming simulations. It provides a value solution for customers who are looking for rapid die design and a virtual tryout tool that generates quick results, is easy to master, but does not sacrifice accuracy.
Tagged at “Best Practice” within INC, the solution pre-populates a set of default parameters produce accurate results. This feature provides a guidedprocess for inexperienced users; while more advanced users can adjust these default parameters to their preferences. Also, INC Solver requires very few manipulations overall to simulate a typical 3-piece draw analysis.
For die face design virtual tryout, the solver offers capabilities for simulating gravity-loading, binder-wrap, crash-form, single-action and double-action draw die, as well as springback prediction and lancing operations. INC solver supports non-conforming CAD surfaces and its fusion-fission approach handles mesh adaptivity effectively.
INC takes advantage of Intel’s latest multiple-core computing platform to make computing very affordable. For example, a 4-Core system costing under $1500 can process the most complicated large bodyside panel simulation in less than 50 minutes.
In addition to DFE, DYNAFORM includes three other modules, including DYNAFORM includes three other modules, including Blank Size Engineering (BSE), LS-DYNA-based Formability Simulation (FS) and LS-DYNA-based Die System Analysis (DSA). DYNAFORM is a complete die system simulation solution which allows organizations to bypass soft tooling, reducing overall tryout time, lowering costs, increasing productivity and providing confidence in die system design.

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